Vacuum lamination machine suitable for all generations and operation method thereof

ABSTRACT

The present invention relates to a vacuum lamination machine suitable for all generations and an operation method thereof. The vacuum lamination machine suitable for all generations includes a stage on which a transfer device, a positioning device, an adhesive application device, a turn-over device, and at least one vacuum lamination device are arranged. The stage has a size that is sufficiently large for all sizes of substrate. The transfer device includes a fork that is adjustable for spacing distance to suit for substrate sizes. The turn-over device includes sufficiently densely arranged vacuum suction pins to suit for substrate sizes. The positioning device includes a size identification system that identifies a rough location of a substrate on the stage and a mark position identification system that carries out precise alignment of the substrate. The vacuum lamination machine supports substrate pairs of various sizes and improves flexibility of use.

This application is a national stage entry of PCT/CN12/76615, filed Jun.8, 2012.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to the technical field of liquid crystalmanufacture, and in particular to a vacuum lamination machine suitablefor all generations and an operation method thereof.

2. The Related Arts

In the cell process of LCD (Liquid Crystal Display), lamination of a TFT(Thin Film Transistor) substrate and a CF (Color Filter) substrate mustbe carried out in a vacuum environment and a vacuum lamination machineis used. The stage of the vacuum lamination machine is of different sizefor manufacture line of different generation. The conventional vacuumlamination machine only suits for a specific generation and cannot beused between different generations, especially for experimentmanufacture lines, making it insufficiently flexible.

Taking Chinese Patent Application No. 200910178174.6 as an example, theconventional vacuum lamination machine generally comprises, on a stage,a transfer device, a positioning device, an adhesive application device,a turn-over device, and at least one vacuum lamination device. Thetransfer device is set at one side of the stage for picking and placingsubstrates from the positioning device, the adhesive application device,the turn-over device, and the vacuum lamination device that are locatedat an opposite side of the stage. The positioning device holds asubstrate to be laminated and position and hold a laminated substrate.The adhesive application device operates an adhesive applicator to applylamination adhesive to a substrate that is transferred by the transferdevice from the positioning device. The turn-over device operates aturn-over machine to turn over a substrate that is transferred by thetransfer device from the adhesive application device. The vacuumlamination device holds, by suction or adhesion, an adhesive-appliedsubstrate and a non-adhesive-applied substrate that are transferred inby the transfer device in a vertical opposing manner and carries outlamination of the substrates in a vacuum environment.

The conventional vacuum lamination machine is subjected to limitation ofthe size of stage. A specific size of stage is only operable forlaminating substrates of a corresponding size. For a mass productionmanufacture line, once the size of the substrate has been determined,lamination can only be performed on substrates of such a size. Thissaves the purchase expenditure of stages. For an experiment manufactureline, it often needs to laminate substrates of different sizes. Theknown designs of vacuum lamination machine available in the market makeit necessary to purchases several stages in order to suit such a need.

SUMMARY OF THE INVENTION

Thus, an object of the present invention is to provide a vacuumlamination machine suitable for all generations and supporting substratepairs of various sizes thereby improving flexibility of use of stage.

Another object of the present invention is to provide an operationmethod for a vacuum lamination machine suitable for all generations thatsupports substrate pairs of various sizes and improves flexibility ofuse of stage.

To achieve the objects, the present invention provides a vacuumlamination machine suitable for all generations, which comprises a stageon which a transfer device, a positioning device, an adhesiveapplication device, a turn-over device, and at least one vacuumlamination device are arranged. The stage has a size that issufficiently large for all sizes of substrate. The transfer devicecomprises a fork that is adjustable for spacing distance to suit forsubstrate sizes. The turn-over device comprises sufficiently denselyarranged vacuum suction pins to suit for substrate sizes. Thepositioning device comprises a size identification system thatidentifies a rough location of a substrate on the stage and a markposition identification system that carries out precise alignment of thesubstrate.

Wherein, the turn-over device controls intensity of air flow of thevacuum suction pins.

Wherein, the size of the stage suits for substrate size of generation 10or greater than generation 10.

Wherein, the size identification system comprises an interface for anoperator to manually enter the substrate size and a detector arranged onthe stage for automatically identifying a right-angle and borderlines ofa substrate, whereby after the operator manually enters the substratesize, the size identification system generates a simulation frame havinga size corresponding to the entered substrate size on a control screen,the detector automatically detecting a right-angle and borderlines ofthe substrate on the stage, the size identification system automaticallymatching the simulation frame with the right-angle or borderlines of thesubstrate on the stage according to the right-angle or borderlinesdetected by the detector, location of the substrate on the stage beingdetermined according to determination of location of the simulationframe.

Wherein, the mark position identification system comprises alignment CCD(Charge Coupling Device) and an interface that allows an operator tomanually enter precise location of a mark on the substrate, thealignment CCD and the vacuum lamination device moving to the markposition according to the entered information of mark position andcarrying out precise alignment for the substrate according to the mark.

The present invention also provides an operation method for a vacuumlamination machine suitable for all generations, which comprises thefollowing steps:

Step 10: transfer device adjusting spacing distance of a fork to suitfor substrate size;

Step 20: an operator manually entering substrate size and a sizeidentification system generating a simulation frame having a sizecorresponding to the entered substrate size on a control screen, adetector arranged on a stage automatically detecting a right-angle andborderlines of a substrate on the stage, the size identification systemautomatically matching the simulation frame with the right-angle orborderlines of the substrate on the stage according to the right-angleor borderlines detected by the detector, whereby location of thesubstrate on the stage is determined according to determination oflocation of the simulation frame;

Step 30: determining a substrate zone for precise alignment throughdetermination of relative position of the substrate and the stage,moving alignment CCD and a vacuum lamination device to the substratezone;

Step 40: manually entering a precise location of a mark on the substratethrough a mark position identification system and moving the alignmentCCD and the vacuum lamination device to the mark location according toentered information of mark location and carrying out precise alignmentfor the substrate according to the mark; and

Step 50: starting a lamination operation after precise alignment.

Wherein, the vacuum lamination machine suitable for all generationscomprises a stage on which a transfer device, a positioning device, anadhesive application device, a turn-over device, and at least one vacuumlamination device are arranged, the stage having a size that issufficiently large for all sizes of substrate, the transfer devicecomprising a fork that is adjustable for spacing distance to suit forsubstrate sizes, the turn-over device comprising sufficiently denselyarranged vacuum suction pins to suit for substrate sizes, thepositioning device comprising a size identification system thatidentifies a rough location of a substrate on the stage and a markposition identification system that carries out precise alignment of thesubstrate.

Wherein, the method further comprises a step of the turn-over deviceadjusting intensity of air flow of the vacuum suction pins.

Wherein, the substrate comprises a TFT substrate or a CF substrate.

Wherein, the size of the stage of the vacuum lamination machine suitablefor all generations suits for substrate size of generation 10 or greaterthan generation 10.

The present invention provides a vacuum lamination machine suitable forall generations, which supports substrate pairs of various sizes andimproves flexibility of use of stage. The operation method for a vacuumlamination machine suitable for all generations according to the presentinvention needs only one vacuum lamination machine suitable for allgenerations to suit for the needs of various substrate sizes, therebyreducing the purchase expenditure of stages.

BRIEF DESCRIPTION OF THE DRAWINGS

The technical solution, as well as beneficial advantages, will beapparent from the following detailed description of embodiments of thepresent invention, with reference to the attached drawings. In thedrawings:

FIG. 1 is a block diagram of a preferred embodiment of a vacuumlamination machine suitable for all generations according to the presentinvention;

FIG. 2 is a schematic view showing structure of a transfer device of apreferred embodiment of a vacuum lamination machine suitable for allgenerations according to the present invention;

FIG. 3 is a schematic view showing structure of a vacuum suction pin ofa preferred embodiment of a vacuum lamination machine suitable for allgenerations according to the present invention;

FIG. 4 is a schematic view illustrating operation of a sizeidentification system of a preferred embodiment of a vacuum laminationmachine suitable for all generations according to the present invention;and

FIG. 5 is a flow chart of an operation method of a vacuum laminationmachine suitable for all generations according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIG. 1, which is a block diagram of a preferred embodimentof a vacuum lamination machine suitable for all generations according tothe present invention, the vacuum lamination machine suitable for allgenerations according to the present invention is formed throughmodification of an existing vacuum lamination machine. Arranged on astage 11 includes a transfer device 12, a positioning device 13, anadhesive application device 14, a turn-over device 15, and at least onevacuum lamination device 16. The stage 11 has a size that issufficiently large for all sizes of substrate. The transfer device 12comprises a fork that is adjustable for spacing distance to suit forsubstrate size. The turn-over device 15 comprises sufficiently denselyarranged vacuum suction pins to suit for substrate size. The positioningdevice 13 comprises a size identification system that identifies a roughlocation of a substrate on the stage and a mark position identificationsystem that carries out precise alignment of substrate.

With a large-sized stage being provided, the vacuum lamination machinesuitable for all generations according to the present invention uses thesize identification system to determine the size of a substrate andidentify the position of the substrate and then uses marks to carry outprecise alignment in order to assemble a TFT substrate and a CFsubstrate together.

The stage is made in a size of G10 or an even larger size. This isdifferent from the existing designs of vacuum lamination machine. Thestages of existing vacuum lamination machines generally correspond tothe size of substrate. The present invention uses a large-sized stage isfor the purpose of allowing substrates of all sizes to be positioned onthe stage to carry out lamination.

The transfer device that is employed in the present invention totransfer substrates is designed in an adjustable form to suit for thesize of substrate. As shown in FIG. 2, which is a schematic view showingstructure of a transfer device of a preferred embodiment of a vacuumlamination machine suitable for all generations according to the presentinvention, the transfer device 1 comprises a fork 2 that is adjustablefor spacing distance. The fork is adjustable according to the directionsof arrows. A regular robot transfer device is adjustable for the spacingdistance of the fork in order to hold substrates of various sizes. Avacuum transfer device has a fork that is also adjustable for thespacing distance in order to hold turned-over substrates of varioussizes.

As shown in FIG. 3, which is a schematic view showing structure of avacuum suction pin of a preferred embodiment of a vacuum laminationmachine suitable for all generations according to the present invention,the turn-over device comprises densely distributed vacuum suction pins,because sucking a substrate requires the cooperative operation of anumber of vacuum suction pins. Sparsely arranged vacuum suction pinscannot meet the need of turning over a small size substrate. Thedistribution density of the vacuum suction pins 3 shown in FIG. 3provide different conditions of being incapable of satisfying, justsatisfying, and fully satisfying with respect to substrates 4, 5, 6 thatare of different sizes. Thus, the greater the density of the vacuumsuction pins 3 is, the smaller the size of substrate that can besupported will be. The turn-over device is capable of controlling airflows through the vacuum suction pins to eliminate the situation that aloaded large size substrate cannot be properly sucked due to excessivelysmall pressure applied, or the situation that a loaded small sizesubstrate is broken by an excessively great force induced by air flows.

The vacuum lamination machine suitable for all generations according tothe present invention comprises a size identification system of whichthe purpose is to identifying a rough location of a substrate on thestage. The size identification system comprises pre-programmed routineto provide an operation interface to a user. As shown in FIG. 4, whichis a schematic view illustrating the operation of the sizeidentification system of a preferred embodiment of a vacuum laminationmachine suitable for all generations according to the present invention,during the operation of the size identification system, a control screendisplays an operation interface, which comprises a stage simulationinterface 7, a substrate simulation frame 8, and a right-angle andborderlines of a substrate captured by a detector. When the sizeidentification system is used to identify the rough position of thesubstrate on the stage, an operator manually enters the size of thesubstrate and the size identification system generates a simulationframe 8 having a size corresponding to the substrate. The detectorarranged on the stage automatically identifies a right-angle andborderlines 9 of the glass substrate, which are displayed on theoperation interface. Next, as indicated by the arrow of FIG. 4, theoperation interface changes, reflecting that the size identificationsystem follows a predetermined process to match the simulation frame andthe captured right-angle and borderlines. According to the right-angleand borderlines detected by the detector, the size identification systemautomatically matches the simulation frame and the right-angle andborderlines to determine the location of the simulation frame. Thelocation of the simulation frame is the location of the substrate on thestage, the error being less than 10 μm.

The present invention uses a mark position identification system forprecise alignment, including alignment CCD and an interface that allowsan operator to manually enter precise location of a mark on thesubstrate. The alignment CCD and the vacuum lamination device move tothe mark position according to the entered information of mark positionand carry out precise alignment for the substrate according to the mark.The mark position identification system comprises a pre-programmedroutine to provide an interface to a user. The user first manuallyenters the precise location of the mark on the substrate with aprecision of 10 μm. Then, according to the entered information oflocation, the alignment CCD and the vacuum lamination device move to themark position and carry out precise alignment for the substrateaccording to the mark.

As shown in FIG. 5, which is a flow chart of an operation method of avacuum lamination machine suitable for all generations according to thepresent invention, the present invention provides an operation method ofa vacuum lamination machine suitable for all generations, whichcomprises:

Step 10: transfer device adjusting spacing distance of a fork to suitfor substrate size;

Step 20: an operator manually entering substrate size and a sizeidentification system generating a simulation frame having a sizecorresponding to the entered substrate size on a control screen, adetector arranged on a stage automatically detecting a right-angle andborderlines of a substrate on the stage, the size identification systemautomatically matching the simulation frame with the right-angle orborderlines of the substrate on the stage according to the right-angleor borderlines detected by the detector, whereby location of thesubstrate on the stage is determined according to determination oflocation of the simulation frame;

Step 30: determining a substrate zone for precise alignment throughdetermination of relative position of the substrate and the stage,moving alignment CCD and a vacuum lamination device to the substratezone, wherein determining the relative position of the substrate and thestage determines the substrate zone for precise alignment and thealignment CCD is a tool for the precise alignment and is moved to thesubstrate zone, the vacuum lamination device being a tool for laminationand being moved to the substrate zone;

Step 40: manually entering a precise location of a mark on the substratethrough a mark position identification system and moving the alignmentCCD and the vacuum lamination device to the mark location according toentered information of mark location and carrying out precise alignmentfor the substrate according to the mark; and

Step 50: starting a lamination operation after precise alignment so asto assemble a TFT substrate and a CF substrate together.

The operation method of a vacuum lamination machine suitable for allgenerations according to the present invention is applicable to thevacuum lamination machine suitable for all generations shown in FIG. 1.Arranged on a stage 11 includes a transfer device 12, a positioningdevice 13, an adhesive application device 14, a turn-over device 15, andat least one vacuum lamination device 16. The stage 11 has a size thatis sufficiently large for all sizes of substrate. The transfer device 12comprises a fork that is adjustable for spacing distance to suit forsubstrate size. The turn-over device 15 comprises sufficiently denselyarranged vacuum suction pins to suit for substrate size. The positioningdevice 13 comprises a size identification system that identifies a roughlocation of a substrate on the stage and a mark position identificationsystem that carries out precise alignment of substrate.

Whether or not the sizes of two substrates to be laminated are standardsizes (G1-G10, each generation having a series of standard sizes) orwhatever generations the two substrates belong to, if and only if thetwo substrates can be paired and laminated, the lamination can becarried out with the vacuum lamination machine suitable for allgenerations according to the present invention and the operation methodthereof.

In summary, the vacuum lamination machine suitable for all generationsaccording to the present invention can be used to assemble TFTsubstrates and the CF substrates of various sizes, particularly forexperiment manufacture line that requires lamination of substrates ofvarious sizes. The operation method for a vacuum lamination machinesuitable for all generations according to the present invention needsonly one vacuum lamination machine suitable for all generations to suitfor the needs of various substrate sizes, thereby reducing the purchaseexpenditure of stages.

Based on the description given above, those having ordinary skills ofthe art may easily contemplate various changes and modifications of thetechnical solution and technical ideas of the present invention and allthese changes and modifications are considered within the protectionscope of right for the present invention.

What is claimed is:
 1. An operation method for a vacuum laminationmachine, comprising the following steps: Step 20: an operator manuallyentering a substrate size corresponding to a substrate positioned on astage and a size identification system generating a virtual simulationframe having a size corresponding to the entered substrate size anddisplaying the virtual simulation frame on a control screen that isseparate from the stage, a detector arranged on the stage automaticallydetecting a right-angle and borderlines of a substrate positioned on thestage and displaying the right-angle and the borderlines on the controlscreen, the size identification system moving the simulation frame onthe control screen to match the right-angle or the borderlines of thesubstrate detected by the detector and displayed on the control screen,whereby, under a condition that the substrate is not moved on the stage,while the virtual simulation frame is moved on the control screen,location of the substrate on the stage is determined according tolocation of the simulation frame on the control screen and the size ofthe substrate is confirmed; Step 30: determining a substrate zone forprecise alignment through determination of relative position of thesubstrate and the stage, moving alignment CCD (charge coupling device)and a vacuum lamination device to the substrate zone; Step 40: manuallyentering a precise location of a mark on the substrate through a markposition identification system and moving the alignment CCD and thevacuum lamination device to the mark location according to enteredinformation of mark location and carrying out precise alignment for thesubstrate according to the mark; and Step 50: starting a laminationoperation after precise alignment.
 2. The operation method for a vacuumlamination machine as claimed in claim 1, wherein the vacuum laminationmachine comprises a stage on which a transfer device, a positioningdevice, an adhesive application device, a turn-over device, and at leastone vacuum lamination device are arranged, the stage having a size thatis sufficiently large for all sizes of substrate, the transfer devicecomprising a fork that is adjustable for spacing distance to suit forsubstrate sizes, the turn-over device comprising vacuum suction pinshaving a predetermined distribution density to suit for substrate sizes,the positioning device comprising a size identification system thatidentifies a rough location of a substrate positioned on the stage and amark position identification system that carries out precise alignmentof the substrate.
 3. The operation method for a vacuum laminationmachine as claimed in claim 2 further comprising a step of the turn-overdevice adjusting intensity of air flow of the vacuum suction pins. 4.The operation method for a vacuum lamination machine as claimed in claim1, wherein the substrate comprises a thin film transistor (TFT)substrate or a color filter (CF) substrate.
 5. An operation method for avacuum lamination machine, comprising the following steps: Step 20: anoperator manually entering a substrate size corresponding to a substratepositioned on a stage and a size identification system generating avirtual simulation frame having a size corresponding to the enteredsubstrate size and displaying the virtual simulation frame on a controlscreen that is separate from the stage, a detector arranged on the stageautomatically detecting a right-angle and borderlines of a substratepositioned on the stage and displaying the right-angle and theborderlines on the control screen, the size identification system movingthe simulation frame on the control screen to match the right-angle orthe borderlines of the substrate detected by the detector and displayedon the control screen, whereby, under a condition that the substrate isnot moved on the stage, while the virtual simulation frame is moved onthe control screen, location of the substrate on the stage is determinedaccording to location of the simulation frame on the control screen andthe size of the substrate is confirmed; Step 30: determining a substratezone for precise alignment through determination of relative position ofthe substrate and the stage, moving alignment CCD (charge couplingdevice) and a vacuum lamination device to the substrate zone; Step 40:manually entering a precise location of a mark on the substrate througha mark position identification system and moving the alignment CCD andthe vacuum lamination device to the mark location according to enteredinformation of mark location and carrying out precise alignment for thesubstrate according to the mark; and Step 50: starting a laminationoperation after precise alignment; wherein the vacuum lamination machinecomprises a stage on which a transfer device, a positioning device, anadhesive application device, a turn-over device, and at least one vacuumlamination device are arranged, the stage having a size that issufficiently large for all sizes of substrate, the transfer devicecomprising a fork that is adjustable for spacing distance to suit forsubstrate sizes, the turn-over device comprising vacuum suction pinshaving a predetermined distribution density to suit for substrate sizes,the positioning device comprising a size identification system thatidentifies a rough location of a substrate positioned on the stage and amark position identification system that carries out precise alignmentof the substrate; further comprising a step of the turn-over deviceadjusting intensity of air flow of the vacuum suction pins; and whereinthe substrate comprises a thin film transistor (TFT) substrate or acolor filter (CF) substrate.